It’s cool, claims Samsung as it pushes 3D IC SoC tech at overheated world

Promises to ladle out more info on grand SRAM at Hot Chips

Samsung Foundry has begun rollout of its latest 3D IC packaging tech, dubbed “eXtended-Cube” or “X-Cube*”, which it claims can result in lower power consumption and faster overall speeds.…

Source link

Leave a Reply

Your email address will not be published. Required fields are marked *

fifteen − eleven =

This site uses Akismet to reduce spam. Learn how your comment data is processed.